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MIL-PRF-914 Resistor Networks, Fixed, Film, Surface Mount, Nonestablished Reliability, And Established Reliability, General Specification ForThis specification covers the general requirements for nonestablished reliability \(non-ER\) and established reliability \(ER\), hermetically sealed \(see 3.27\) and nonhermetically sealed networks \(see 3.27.1\). These networks consist entirely of fixed, film resistors. They are primarily intended for use in surface mount applications where space is a major concern. ER resistors covered by this specification will have life failure rates \(FR\) ranging from 1 percent to 0.001 percent per 1,000 hours \(see 1.2.1.7\). The ER FR are established at a minimum 60-percent confidence level on the basis of life tests. Designers are CAUTIONED on using these resistors in pulse applications \(see 6.4.4\).

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MIL-PRF-914C

3.14 Low temperature operation. When networks are tested as specified in 4.8.9, there shall be no evidence of

mechanical damage. The change in resistance between initial and final measurements shall not exceed the values

specified:

Delta R

Resistance ratio

Characteristic

�(0.50 percent +0.01 ohm)

�(0.25 percent +0.01 ohm)

�(0.10 percent +0.01 ohm)

C, R and V

�(0.10 percent +0.01 ohm)

�0.02 percent

3.15 Short-time overload. When networks are tested as specified in 4.8.10, there shall be no evidence of arcing,

burning, or charring. The change in resistance between initial and final measurements shall not exceed the values

specified:

Delta R

Resistance ratio

Characteristic

�(0.50 percent +0.01 ohm)

�(0.25 percent +0.01 ohm)

�(0.10 percent +0.01 ohm)

C, R and V

�(0.10 percent +0.01 ohm)

�0.02 percent

3.16 Adhesion (not applicable to gullwing packages). When networks are tested as specified in 4.8.11, there shall

be no evidence of mechanical damage.

3.17 Terminal strength (not applicable to Leadless Chip Carriers (LCC)). When networks are tested as specified in

4.8.12, there shall be no evidence of breaking or loosening of terminals from the network form, or chipping of coating.

The change in resistance between initial and final measurements shall not exceed the values specified:

Delta R

Resistance ratio

Characteristic

K, M and H

�(0.25 percent +0.01 ohm)

C, R, and V

�(0.10 percent +0.01 ohm)

�0.03 percent

3.18 Dielectric withstanding voltage. When networks are tested as specified in 4.8.13, there shall be no

mechanical damage, arcing, or breakdown. The leakage current shall not exceed 1 milliampere (mA).

3.19 Insulation resistance. When networks are tested as specified in 4.8.14, the insulation resistance shall not be

less than 10,000 megohms.

3.20 Resistance to soldering heat. When networks are tested as specified in 4.8.15, there shall be no evidence of

mechanical damage, no demetallization, or leaching. The change in resistance between initial and final measurements

shall not exceed the values specified:

Characteristic

Delta R

Resistance ratio

K, M and H

�(0.25 percent +0.01 ohm)

C, R, and V

�(0.25 percent +0.01 ohm)

�0.02 percent

3.21 Moisture resistance. When networks are tested as specified in 4.8.16, there shall be no evidence of

mechanical damage. The change in resistance between initial and final measurements shall not exceed the values

specified:

Delta R

Resistance ratio

Characteristic

K, and M

�(0.50 percent +0.01 ohm)

�(0.40 percent +0.01 ohm)

C, R, and V

�(0.20 percent +0.01 ohm)

�0.02 percent

Additionally, the dielectric withstanding voltage shall be as specified in 3.18 and the insulation resistance shall be 100

megohms minimum.