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MIL-PRF-914 Resistor Networks, Fixed, Film, Surface Mount, Nonestablished Reliability, And Established Reliability, General Specification ForThis specification covers the general requirements for nonestablished reliability \(non-ER\) and established reliability \(ER\), hermetically sealed \(see 3.27\) and nonhermetically sealed networks \(see 3.27.1\). These networks consist entirely of fixed, film resistors. They are primarily intended for use in surface mount applications where space is a major concern. ER resistors covered by this specification will have life failure rates \(FR\) ranging from 1 percent to 0.001 percent per 1,000 hours \(see 1.2.1.7\). The ER FR are established at a minimum 60-percent confidence level on the basis of life tests. Designers are CAUTIONED on using these resistors in pulse applications \(see 6.4.4\).

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MIL-PRF-914C
DEPARTMENT OF DEFENSE SPECIFICATION
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Resistor Network, Fixed, Film, Surface Mount, 16-Pin, Leadless Chip
Carrier, Nonestablished Reliability and Established Reliability, Style
RNS030.
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Resistor Network, Fixed, Film, Surface Mount, 20-Pin, Leadless Chip
Carrier, Nonestablished Reliability and Established Reliability, Style
RNS040.
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Resistor Network, Fixed, Film, Surface Mount, 16-Pin, Leadless Chip
Carrier, Nonestablished Reliability and Established Reliability, Style
RNS050.
DEPARTMENT OF DEFENSE STANDARDS
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Tests Methods for Electronic and Electrical Components Parts.
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Failure Rate Sampling Plans and Procedures.
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Established Reliability and High Reliability Qualified Products List
(QPL) Systems for Electrical, Electronic, and Fiber Optic Parts
Specifications.
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Environmental Engineering Considerations and Laboratory Test.
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Marking of Electrical and Electronic Parts.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or
https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094).
2.3 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of the documents cited in the solicitation or contract (see 6.2).
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
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Requirements for Soldering Fluxes.
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Requirements for Electronic Grade Solder alloys and Fluxed and
Non-Fluxed Solid Solders for Electronic Soldering Applications.
(Applications for copies should be addressed to the IPC - Association Connecting Electronics Industries
2215 Sanders Road Northbrook, Illinois, United States, 60062-6135. https://www.ipc.org)
ELECTRONIC INDUSTRIES ASSOCIATION (EIA)
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Assessment of Average Outgoing Quality Levels in Parts Per Million
(PPM).
-
Statistical Process Control Systems.
(Applications for copies should be addressed to the Electronic Industries Association, 2500 Wilson Boulevard,
Arlington, VA 22201-3834. http//www.eia.org)
2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein (except for related specification sheets), the text of this document takes precedence unless otherwise noted.
Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has
been obtained.
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