MIL-PRF-914C
4.8.25 Fungus (see 3.30). Networks shall be tested in accordance with method 508 of MIL-STD-810. Networks
shall be inspected for evidence of fungus.
5. PACKAGING.
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within
the military services system commands. Packaging data retrieval is available from the managing Military Department's
or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging
activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory).
6.1 Intended use. Networks described herein are intended to be used in surface mount applications.
6.2 Acquisition requirements. Acquisition documents must specify the following:
a.
Title, number, and date of this specification, and the complete PIN (see 1.2).
b.
If not otherwise specified (see 2.1), the versions of the individual documents referenced will be those in
effect on the date of release of the solicitation.
c.
Packaging instructions (see 5.1) (e.g., Electrostatic discharge (ESD) sensitivity (see 6.4.3))
d.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products that are,
at the time of award of contract, qualified for inclusion in the applicable QPL whether or not such products have
actually been so listed by that date. The attention of the contractor is called to these requirements, manufacturers
are urged to arrange to have the products that they propose to offer to the Federal Government tested for
qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered
by this specification. The activity responsible for the Qualified Products List is the US Army Communication -
Electronics Command, ATTN: AMSEL-LC-LEO-E-EP, Fort Monmouth, NJ 07703-5023; however, information
pertaining to qualification of products may be obtained from the Defense Supply Center, Columbus,
ATTN: DSCC-VQP, P.O. Box 3990, Columbus, Ohio 43218-3990
6.4 Application notes.
6.4.1 Close-tolerance networks. Close tolerance networks (i.e., 0.1 percent and tighter) should be mounted by a
method which produces the least heating effect over a short time to avoid permanent change in resistance.
6.4.2 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545
(Standard Specification for Electrodeposited Coatings of Tin).
6.4.3 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged,
by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or
shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 that specifies a preventive
packaging procedure.
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