MIL-PRF-914 Resistor Networks, Fixed, Film, Surface Mount, Nonestablished Reliability, And Established Reliability, General Specification ForThis specification covers the general requirements for nonestablished reliability \(non-ER\) and established reliability \(ER\), hermetically sealed \(see 3.27\) and nonhermetically sealed networks \(see 3.27.1\). These networks consist entirely of fixed, film resistors. They are primarily intended for use in surface mount applications where space is a major concern. ER resistors covered by this specification will have life failure rates \(FR\) ranging from 1 percent to 0.001 percent per 1,000 hours \(see 1.2.1.7\). The ER FR are established at a minimum 60-percent confidence level on the basis of life tests. Designers are CAUTIONED on using these resistors in pulse applications \(see 6.4.4\).

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MIL-PRF-914C

3. REQUIREMENTS

3.1 Specifications sheets. The individual item requirements shall be as specified herein and in accordance with

the applicable associated specifications. In the event of any conflict between the requirements of this specification

and the associated specifications, the latter shall govern (see 6.2).

3.2 Qualification. Networks furnished under this specification shall be products that are authorized by the

qualifying activity for listing on the applicable Qualified Products List (QPL) at the time of award of contract

(see 4.4 and 6.3). In addition, the manufacturer shall obtain certification from the qualifying activity that the QPL

system requirements of 3.3 and 4.2 have been met and are being maintained.

3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by this

specification. Requirements for this system are specified in MIL-STD-790 (all product levels) and MIL-STD-690 (ER

parts only). In addition, the manufacturer shall also establish a Statistical Process Control (SPC) and Part Per Million

(ppm) system that meets the requirements as described in 3.3.1. and 3.3.2 respectively.

3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a SPC

system that meets the requirements of EIA-557. Typical manufacturing processes for application of SPC include film

deposition, cap/lead attachment, laser trimming, encapsulation, termination finish, and weld strength. In addition, the

manufacturer shall demonstrate resistance temperature characteristic (RTC) control in the process.

3.3.2 PPM system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a ppm

system for assessing the average outgoing quality of lots in accordance with EIA-554-1 and 4.6.4. Data exclusion, in

accordance with EIA-554-1, may be used with approval of the qualifying activity. The ppm system shall identify the

ppm rate at the end of each month and shall be based on a six month moving average. DC resistance shall be

assessed for each style. Style reporting may include both non-ER and ER style combinations.

3.4 Material. The material shall be as specified herein. However, when a definite material is not specified, a

material shall be used which will enable the networks to meet the performance requirements of this specification.

Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the

finished product.

3.5 Interface and physical dimension. Networks shall meet the interface and physical dimensions specified. Each

network shall consist of film type resistance elements with terminations (see 3.1).

3.5.1 Enclosure. Networks shall be encapsulated sufficiently to withstand the environmental tests specified.

There shall be no voids that expose the internal circuitry.

3.5.2 Terminations. Terminations shall be free of foreign material and solderable as specified. Terminations shall

be judged to be free of foreign material if the visual criteria are met.

3.5.2.1 Solder dip (retinning) leads. The manufacturer (or authorized category B or category C distributor) may

solder dip/retin the leads of the product supplied to this specification provided the solder dip process (see appendix A)

has been approved by the qualifying activity.

3.5.3 Metallization resistance. The resistance of the metallization of the longest path in the network shall not

exceed the limit in table VII.

3.5.4 Soldering. If soldering is used for internal connections, it shall be of such a quality as to enable the networks

to meet all the requirements of this specification.

3.5.5 Internal visual inspection (applicable to die and wire bond construction). Networks shall be subjected to a

100 percent precap visual inspection to verify that the interface, physical dimensions, and workmanship are in

accordance with the applicable requirements (see appendix B).