MIL-PRF-914C
4.8.8 Resistance-temperature characteristic (see 3.13). Networks shall be tested in accordance with method 304
of MIL-STD-202. The following details and exceptions shall apply:
a.
Mounting: Method A or method B (see 4.8.1).
b.
Reference temperature: Room ambient temperature.
c.
Test temperature: In accordance with table XIX.
TABLE XIX. Resistance-temperature characteristic.
O
Temperature in C
Sequence
Qualification
Group B
inspection
inspection
1
25 ±3 1/
25 ±3 1/
2
-15 ±3
-55 ±3
3
-55 ±3
25 ±3 1/
4
25 ±3 1/
125 ±3
5
65 ±3
25 ±3 1/
6
125 ±3
1/ This temperature shall be considered the
reference temperature for each of the
succeeding temperatures.
NOTE: At the option of the manufacturer, group B inspection may be in the reverse sequence of table XIX as
follows:
25OC
±3OC.
1.
O
±3OC.
125 C
2.
25OC
±3OC.
3.
O
±3OC.
-55 C
4.
4.8.9 Low temperature operation (see 3.14). Resistors shall be mounted as specified in 4.8.1, method A or
method B. Following a dc resistance measurement as specified in 4.8.5, the networks shall be placed in a cold
chamber at -65OC +0OC, -5OC. After 1 hour of stabilization at this temperature, full rated continuous working voltage
as specified in 3.7 shall be applied for 45 minutes +5 minutes, -0 minutes. The networks may be loaded individually
or in parallel. Fifteen minutes +5 minutes, -0 minutes after the removal of the voltage, the temperature in the
chamber shall be gradually increased to room temperature within a period of not more than 8 hours. The networks
shall be removed from the chamber and maintained at a temperature of 25OC ±5OC; the dc resistance shall be
measured as specified in 4.8.5. Networks shall be inspected for evidence of mechanical damage.
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