MIL-PRF-19E
4.7.17 Fungus (see 3.22). Resistors shall be tested in accordance with method 508 of MIL-STD-810. Resistors
shall be examined for evidence of mechanical damage.
5. PACKAGING
5.1 Packaging. For acquisition purpose, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the military services system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory).
6.1 Intended use. Resistors covered by this specification are intended for use in electronic equipment, and are
used for matching, balancing, and adjusting circuit variables in computers, telemetering equipment, and other
applications. These devices must be able to operate satisfactorily in military systems under the following demanding
conditions: 15 Gs of high frequency vibration, 100 Gs of shock (specified pulse), 25,000 cycles of endurance at the
maximum temperature, thermal shock (with no more than 5% deviation in initial resistance), low temperature
coefficient of resistance and resistant to salt corrosion. In addition these military requirements are verified under a
qualification system. Commercial components are not designed to withstand these military environmental conditions.
6.2 Acquisition documents. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Title, number, and date of the applicable detail specification, and complete PIN (see 1.2 and 3.1).
c. If not otherwise spcified, the version of the individual documents referenced will be those in effect on the
sate of the solicitation (see 2.1).
d. Packaging requirements (see 5.1).
e. Mounting Hardware, whether assembled on resistor (see 3.4.7).
f. Mounting nut dimension across hexagonal flats, as applicable (see 3.1).
g. Location at which inspection shall be made if other than suppliers facilities or commercial laboratory
(see 4.2).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in QPL whether or not such products have actually been so
listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to
arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from Defense Supply Center, Columbus, ATTN: DSCC-VQP,
P.O. Box 3990, Columbus, OH 43218-3990
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