MIL-R-10509J
APPENDIX A
A.5.3 Solder dip retinning options. The manufacture may solder dip/retin as follows:
a. After the 100 percent group A screening tests: Following the solder dip/retinning process, the electrical measurements required in group A, subgroup 1, 100 percent screening tests shall be repeated on 100 percent of the lot. (NOTE: The manufacturer may solder dip/retin prior to the
100 percent electrical measurements of the group A, subgroup 1 tests). The percentage defective allowable (PDA) for the electrical measurements, shall be as for the subgroup 1 tests.
b. As a corrective action, if the lot fails the group A solderability test, the lot may be retinned no more than two times. The lot after retinning shall be 100 percent screened for group A electrical requirements (dc resistance) and parts failing (lot not exceeding PDA for group A, subgroup 1, see
4.6.3.1.1) these screens shall not be supplied to his specification, if electrical failures are detected after the second retinning operation exceeding 1 percent of the lot, the lot shall not be supplied to this specification.
c. After group A inspection has been completed. Following the solder dip/retinning process, the electrical measurements required in group A, subgroup 1, 100 percent screening tests shall be repeated on 100 percent of the lot. The PDA for the electrical measurements shall be as for the subgroup 1 tests. Following these tests, the manufacturer shall submit the lot to the group A solderability test as specified in 4.7.14.
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