MIL-R-10509J
APPENDIX A
TABLE A-III. Extension of approval of resistance tolerances.
Resistance tolerance submitted |
Will qualify resistance tolerance |
B C D F |
B, C, D, F C, D, F D, F F |
A.5. SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer may solder dip/retin the leads of product supplied to this specification provided the solder dip process has been approved by the qualifying activity.
A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options:
a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276. (NOTE: The 200 microinch maximum thickness is not applicable). The manufacturer shall use the same solder dip process for retinning as is used in the original manufacture of the product.
b. When the lead originally qualified was not hot solder dip finish 52 of MIL-STD-1276 as prescribed in A.5.2a, approval for the process to be used for solder dip shall be based on the following test procedure:
(1) Thirty samples of any resistance value for each style and lead finish are subjected to the manufacturer's solder dip process. Following the solder dip process, the resistors are subjected to the dc resistance test (and other group A electricals). No defects allowed.
(2) Ten of the 30 samples are then subjected to the solderability test. No defects allowed.
(3) The remaining 20 samples are subjected to the resistance to soldering heat test followed by the moisture resistance test. No defects allowed.
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