MIL-PRF-914C
4.8.20 High temperature exposure (see 3.25).
a.
Mounting: Not required.
O
O
b.
Initial measurements: DC resistance shall be measured as specified in 4.8.5 at 25 C ±2 C.
c.
Procedure: Following initial resistance measurements, networks shall be placed in a chamber with forced
air circulation maintained at 125OC ±5OC for a period of 100 hours ±4 hours with no load applied.
d.
Final measurements: After removal from the test chamber, networks shall be permitted to stabilize at an
O
O
ambient temperature of 25 C ±5 C. Resistance measurements shall be made as specified in 4.8.5.
Networks shall be inspected for evidence of mechanical damage.
4.8.21 Low temperature storage (see 3.26).
a.
Mounting: Not required.
Procedure: DC resistance shall be measured as specified in 4.8.5. Within 1 hour after this measurement,
b.
O
O
O
the networks shall be placed in a cold chamber at -65 C +0 C, -3 C. Twenty-four hours after the networks
have reached this temperature, the temperature of the chamber shall be gradually increased to room
temperature within a period of not more than 8 hours. The networks shall be removed from the chamber
Networks shall be inspected for evidence of mechanical damage.
4.8.22 Hermetic seal (applicable to characteristic C) (see 3.27). Networks shall be tested in accordance with
method 112 of MIL-STD-202. The following details shall apply:
a.
b.
Gross leak test: Test condition D.
4.8.23 Steady-state humidity (see 3.28). Networks shall be tested at a steady state humidity condition of
O
O
85 C ±3 C, 85 percent ±5 percent relative humidity for a period of 1,000 hours +96 hours, -0 hours. The following
details and exceptions shall apply:
a.
Mounting: Method B (see 4.8.1.2).
b.
Initial measurement: Same as 4.8.16b.
Loading voltage: Same as 4.8.16c.
c.
d.
Interval measurement is at 1,000 hours +96 hours, -0 hours. The networks will be allowed to stabilized to
room ambient conditions prior to any electrical measurement.
e.
Final measurements: Same as 4.8.16f.
Inspection after test: Same as 4.8.16g.
f.
4.8.24 Bond pull (applicable to configuration C of styles RNS030 and RNS040) (see 3.29). Networks shall be
mounted as specified in 4.8.1.2, method B. Pull tester/gauge and hook, (HMP model, with a 0 gram to 15 gram scale
or equivalent) shall be used. All wire bonds are to be visually inspected to confirm acceptability prior to pull test
(see 3.5.5). Four bonding pads shall be randomly selected and shall be subjected to the bond pull test as specified.
The pull test is applied by inserting the hook under the loop of the bonding wire and with the substrate held down, the
pulling force is applied approximately at the center of the loop for 30 seconds minimum at a minimum force of 6
grams
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