MIL-PRF-39015E
APPENDIX A
A.5 SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer (or their authorized category B or category C
distributor) may solder dip/retin the leads of product supplied to this specification provided the solder dip
process (see A.5.2 of this appendix A) or an equivalent process has been approved by the qualifying
activity.
A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the
following options:
a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276 (NOTE:
The 200 microinch maximum thickness is not applicable). The manufacturer shall use the same
solder dip process for retinning as is used in the original manufacture of the product.
b. When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as
prescribed in A.5.2a, approval for the process to be used for solder dip shall be based on the
following test procedure:
(1) Thirty samples of any resistance value for each style and lead finish are subjected to the
manufacturers solder dip process. Following the solder dip process, the resistors are
subjected to the dc resistance test and other group A electricals. No defects are allowed.
(2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.
(3) The remaining 20 samples are subjected to the resistance to solder heat test followed by the
moisture resistance test. No defects are allowed.
A.5.3 Solder dip/retinning options. The manufacturer (or their authorized category B or category C
distributor) may solder dip/retin as follows:
a. After the 100 percent group A screening tests: Unless otherwise approved (see 4.6.3.2.2) for lots
subjected to this process, electrical measurements are required in accordance with group A,
subgroup 2 (PPM) (NOTE: The manufacturer may solder dip/retin prior to the 100 percent
electrical measurements of the group A, subgroup 1 tests). The percentage defective allowable
(PDA) for the electrical measurements, shall be the subgroup 1 tests.
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b.
As a corrective action, if the lot fails the group A solderability test: The lot may be retinned no
more than two times. The lot after retinning shall be 100 percent screened for group A electrical
requirements (total resistance). Any parts failing (lot not exceeding PDA for group A, subgroup 1,
see 4.6.3.2.1) these screens shall not be supplied to this specification. If electrical failures
exceeding 1 percent of the lot are detected after the second retinning operation, the lot shall not
be supplied to this specification.
c.
After the group A inspection has been completed: Following the solder dip/retinning process, the
electrical measurements required in group A, subgroup 1, 100 percent screening test shall be
repeated on 100 percent of the lot. The PDA for the electrical measurements shall be as for the
subgroup 1 tests. Following these tests, the manufacturer shall submit the lot to the group A
solderability test as specified in 4.6.3.2.5.
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