MIL-PRF-22097J
4.6.2.1.3 Subgroup 3 (solderability). A sample of five parts from each inspection lot shall be selected and
subjected to the subgroup 3 solderability test. If one or more defects, the lot shall be considered to have failed. As
an option, the manufacturer may use electrical rejects from the subgroup 1 tests for all or part of the sample. If there
are one or more defects, the lot is rejected. The manufacturer may use one of the following options for corrective
action:
a.
Each production lot that was used to form the failed inspection lot shall be individually submitted to the
solderability test. Production lots that pass the solderability test are available for shipment. Production lots
failing the solderability test can be submitted to the solder dip procedure in 4.6.2.1.3b.
b.
The lot is submitted to a 100 percent solder dip using an approved solder dip process in accordance with the
appendix. A subsequent solderability test shall then be performed. If the lot passes, it is available for
shipment; if the lot fails, the manufacturer may perform the hot solder dip one additional time. If the lot fails
to pass, the lot is considered rejected and shall not be supplied to this specification.
4.6.2.1.4 Disposition of samples. The solderability test is considered a destructive test and samples submitted to
the solderability test shall not be supplied to this specification.
4.6.3 Group B inspection. Group B inspection shall consist of the tests specified in table VIII, in the order shown,
and the sample shall be selected from inspection lots that have passed group A inspection.
TABLE VIII. Group B inspection. 1/
Requirement
Method
Sampling
Inspection
paragraph
paragraph
Procedure
Subgroup 1
Actual effective electrical travel
Dielectric withstanding voltage
Insulation resistance
Torque
Subgroup 2
Thermal shock
1/ See table XII.
4.6.3.1 Subgroup 1. A sample of parts shall be randomly selected in accordance with table IX. If one or more
defects are found, the lot shall be reworked or screened and defectives removed. After reworking or screening and
removal of defectives, a new sample of parts shall be randomly selected in accordance with table IX. If one or more
defects are found in the second sample, the lot shall be not supplied to this specification.
TABLE IX. Group B sampling plan.
Subgroup 1 and 2
Lot size
sampling plan
1
to
25
3
26
to
50
5
51
to
90
6
91
to
150
7
151
to
280
10
281
to
500
11
501
to
1,200
15
1,201
to
3,200
18
3,201
to 10,000
22
10,000
and over
29
15
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