MIL-PRF-22097J
3.31.3 Process. Soldered connections shall be neat. There shall be no sharp points or rough spots surfaces
resulting from heating. The solder shall feather out to a thin edge, indicating proper flowing and wetting action, and
shall not be crystallized, overheated, or underheated. The minimum necessary amount of flux shall be used for
electrical connections. Whenever practical, excess resin shall be removed with a wire brush and a dry cloth. Any
resulting loose flakes of resin shall be removed. Insulation resistance material that has been subjected to heating
during the soldering operation shall be undamaged and parts fastened thereto shall not have become loosened.
3.32 Welding and brazing. Where welding and brazing is employed, the electrical connections shall be
mechanically secure and electrically continuous after welding or brazing. Where brazing is employed, only
substantially noncorrosive fluxes shall be used, unless it can be shown that corrosive elements have been
satisfactorily removed after brazing.
3.33 Recycling, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally
preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the
operational and maintenance requirements, and promotes economically advantageous life cycle costs.
3.34 Workmanship. Resistors shall be processed in a manner as to be uniform in quality and shall be free from
holes, fissures, chip, and malformation. The leads shall be unbroken and not crushed or nicked, and the resistors
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.4).
b.
Conformance inspection (see 4.6).
4.2 Test equipment and inspection facilities. The manufacturer shall establish and maintain a calibration system in
accordance with NCSL Z540-1, ISO 10012-1, or equivalent system as approved by the qualifying activity.
4.3 Inspection conditions and precautions.
4.3.1 Inspection conditions. Unless otherwise specified herein, all inspections shall be in accordance with the test
4.3.2 Precautions. Adequate precautions shall be taken during inspection to prevent condensation of moisture on
resistors. Precautions shall also be taken to prevent damage by heat when soldering resistor leads to terminals.
4.4 Qualification. Qualification inspection shall be performed at a laboratory acceptable to the Government
(see 6.3) on sample units produced with equipment and procedures normally used in production.
4.4.1 Sample size. The number of sample units comprising a sample of resistors to be subjected for qualification
inspection shall be as in the appendix to this specification.
4.4.2 Inspection routine. Sample units with any terminal type shall be subjected to the qualification inspection
specified in table V, in the order shown. Thirty enclosed sample units shall be subjected to the inspection of group I.
They shall then be divided into five groups of six units each, for groups II to VI, inclusive, and subjected to the
inspection for their particular group. The remaining three enclosed sample units shall be subjected to the inspection
of group VII only. The two unenclosed sample units shall be subjected only to the visual and mechanical inspection
of group I. Five enclosed or unenclosed sample units shall be subjected to the fungus test in group VIII. Qualification
shall be extended to other terminal types of the same style and characteristic by submission of samples to additional
testing in accordance with table A-I.
4.4.3 Failures. Failures in excess of those allowed in table V shall be cause for refusal to grant qualification.
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