MIL-PRF-49462C
4.8.16 Outgassing (see 3.21). The resistors organic materials shall be tested in accordance with
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5. PACKAGING
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5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor
personnel, these personnel need to contact the responsible packaging activity to ascertain packaging
requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity
within the Military Department or Defense Agency, or within the military service's system commands.
Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not
mandatory.)
6.1 Intended use. The resistors covered by this specification are military unique due to the fact that
these devices must be able to operate satisfactorily in military systems under the following demanding
conditions; 20 G's of high frequency; 100 g's of shock (specified pulse); thermal shock (with no more
than .5 percent deviation in initial resistance). In addition, these military requirements are verified under a
qualification system. Commercial components are not designed to withstand these military environmental
conditions.
6.2 Acquisition requirements. Acquisition documents must specify the following:
a. Title, number, and date of the specification, the applicable associated specification, and complete
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b. If not otherwise specified (see 2.1), the versions of the individual documents referenced will be
those in effect on the date of the solicitation.
c. Packaging requirements (see 5.1).
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6.3 Qualification. With respect to products requiring qualification, awards are made only for products
which are, at the time of award of contract, qualified for inclusion in Qualified Products List whether or not
such products shave actually been so listed by the date. The attention of the contractors is called to
these requirements, and manufacturers are urged to arrange to have the products that they propose to
offer to the Federal Government tested for qualification in order that they may be awarded contracts or
orders for the products covered by this specification. Information pertaining to qualification of products
may be obtained from Defense Supply Center, Columbus, ATTN: DSCC-VQP, Post Office Box 3990,
Columbus, Ohio 43218-3990. An online listing of products qualified to this specification may be found in
the Qualified Products Database (QPD) at https://assist.daps.dla.mil.
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6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may
exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to
years after manufacture and can develop under typical operating conditions, on products that use such
materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation
of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For
additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited
Coatings of Tin).
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