MIL-PRF-39017G
3.3 QPL system. The manufacturer shall establish and maintain a QPL system for parts covered by
this specification. Requirements for this system are specified in MIL-STD-790 (all product levels) and
MIL-STD-690 (ER part only). In addition, the manufacturer shall also establish a Statistical Process
Control (SPC) and Part Per Million (PPM) system that meets the requirements as described in 3.3.1 and
3.3.2 respectively.
3.3.1 SPC system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish a
SPC system that meets the requirements of EIA-557. Typical manufacturing processes for application of
SPC include film deposition, cap/lead attachment, laser trimming, encapsulation, and weld strength. In
addition, the manufacturer shall demonstrate resistance temperature characteristic (RTC) control in the
process.
3.3.2 PPM system. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish
a PPM system for assessing the average outgoing quality of lots in accordance with EIA-554-1 and 4.6.4.
Data exclusion, in accordance with EIA-554-1, may be used with approval of the qualifying activity. The
PPM system shall identify the PPM rate at the end of each month and shall be based on a six month
moving average. PPM and dc resistance shall be assessed for each style. Style reporting may include
both non-ER and ER style combinations.
3.4 Material. Material shall be used which will enable the resistors to meet the performance
requirements of this specification. Acceptance or approval of any constituent material shall not be
construed as a guarantee of the acceptance of the finished product.
3.5 Interface and physical dimensions requirements. Resistors shall meet the interface, and physical
dimensions specified (see 3.1). Each resistor shall consist of a film-type resistance element protected
against exposure to humidity and temperature conditions by an enclosure or a coating of moisture-
resistant, insulating material.
3.5.1 Aqueous-extract-conductivity. The manufacturer shall verify by certification that the aqueous-
extract-conductivity, when determined as specified in 4.8.21 does not exceed the values shown below for
the incoming materials for the part indicated:
Maximum conductivity
Part
(siemens (mhos) per cm)
0.5 x 10 -6
Core
3.5.2 Films. Films shall be uniformly deposited.
3.5.3 Terminal leads. Terminal leads shall be of a solid conductor of the length and diameter specified
(see 3.1). Manufacturers shall verify by certification that all leads conform to all requirements of type C of
table II. The leads shall be capable of meeting the requirements of solderability (see 3.16 and figure 1).
Terminal leads meeting requirements specified herein shall be considered solderable and weldable. At
the option of the manufacturer, the terminals may be solder-coated or otherwise treated to meet the
solderability requirements following the power conditioning test specified in 4.8.2.
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