MIL-PRF-39017G
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3.5.3.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and
externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin
shall be alloyed with a minimum of 3 percent lead, by mass (see 6.16).
3.5.3.2 Flux. Flux shall be of such a quality as to enable the resistors to meet all the requirements of
this specification.
3.5.3.3 Solder dip (retinning) leads. The manufacturer (or his authorized category B or category C
distributor) may solder dip/retin the leads of product supplied to this specification provided the solder dip
process (see appendix) has been approved by the qualifying activity.
3.5.4 Weight. Resistors shall not exceed the maximum weight specified (see 3.1).
NOTE: Exposed copper or base metal due to lead attachment within .050 (1.27 mm) of the resistor
body shall not be considered a reliability problem.
FIGURE 1. Solderability requirements.
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