MIL-PRF-39017 Resistors, Fixed, Film \(Insulated\), Nonestablished Reliability, And Established Reliability, General Specification ForThis specification covers the general requirements for nonestablished reliability \(non-ER\) and established reliability \(ER\), insulated, film, fixed resistors. These resistors are capable of full load operation at an ambient temperature of 70 Degrees C and have a resistance temperature characteristic of 100 parts per million \(PPM\) and 350 PPM per degree Celsius \(PPM/Degrees C\). The ER resistors have life failure rate \(FR\) levels ranging from 1.0 percent to 0.001 percent per 1,000 hours \(see 1.2.1.4\). These FR levels are established at a 60 percent confidence level on the basis of life tests. Designers are CAUTIONED on using these resistors in high power pulse applications \(see 6.13.2\).

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MIL-PRF-39017G

APPENDIX A

TABLE A-III. Tolerance.

Tolerance

Will qualify

tolerance

G, J, K

J, K

A.5 SOLDER DIP (RETINNING) LEADS

A.5.1 Solder dip (retinning) leads. The manufacturer (or their authorized category B or category C

distributor) may solder dip/retin the leads of product supplied to this specification provided the solder dip

process (see A.5.2 of this appendix) or an equivalent process has been approved by the qualifying

activity.

A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the

following options:

a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276 (NOTE:

The 200 microinch maximum thickness is not applicable). The manufacturer shall use the same

solder dip process for retinning as is used in the original manufacture of the product.

b. When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as

prescribed in A.5.2a, approval for the process to be used for solder dip shall be based on the

following test procedure:

(1) Thirty samples of any resistance value for each style and lead finish are subjected to the

manufacturers solder dip process. Following the solder dip process, the resistors are

subjected to the dc resistance test and other group A electricals. No defects are allowed.

(2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.

(3) The remaining 20 samples are subjected to the resistance to solder heat test followed by the

moisture resistance test. No defects are allowed.

(NOTE: Solder dip of gold plated leads is not allowed.)