MIL-PRF-39009E
APPENDIX A
A.4 EXTENSION OF QUALIFICATION
A.4.1 Qualification extension of FRL. The extension of qualification or resistance values for each style
shall range between the highest and lowest values qualified. The extension of qualification between the
FR shall be as follows:
Will qualify FRL
FRL
S
R, P, M, C
R
P, M, C
P
M, C
M
C
A.4.2 Qualification between styles. Noninductive type styles will qualify corresponding inductive type
styles as specified as follows:
Noninductive style 1/
Will qualify style
RER40
RER60
RER45
RER65
RER50
RER70
RER55
RER75
1/ Qualification of maximum resistance
values in the 40, 45, 50, and 55 series will
also qualify the highest resistance values
in 60, 65, 70, and 75 series.
A.5 SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer (or their authorized category B or category C
distributor) may solder dip/retin the leads of product supplied to this specification provided the solder dip
process (see A.5.2) or an equivalent process has been approved by the qualifying activity.
A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the
following options:
a. When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276. (NOTE:
The 200 microinch maximum thickness is not applicable.) The manufacturer shall use the same
solder dip process for retinning as is used in the original manufacture of the product.
b. When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as
prescribed in A.5.2a, approval for the process to be used for solder dip shall be based on the
following test procedure:
(1)
Thirty samples of any resistance value for each style and lead finish are subjected to the
manufacturer's solder dip process. Following the solder dip process, the resistors are
subjected to the dc resistance test (and other group A electricals). No defects are allowed.
(2)
Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.
(3)
The remaining 20 samples are subjected to the resistance to solder heat test followed by
the moisture resistance test. No defects allowed.
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