MIL-PRF-914C
APPENDIX A
TABLE A-V. Extent of qualification by schematic.
Will qualify
Will qualify
Schematic
Schematic
schematic(s)
schematic(s)
S
S
J
J
M
M, P, E, W
A
A, C
P
P, E, W
B
B, C, A
E
E, W, P
C
C, A
W
W, E
A.5 SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer (or authorized category B or category C distributor) may
solder dip/retin the leads of product supplied to this specification provided the solder dip process of this appendix or
an equivalent process has been approved by the qualifying activity.
(NOTE: Solder dip of termination A, termination B, termination C, and termination Z is not allowed).
A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options:
a.
When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276. (NOTE: The 200
micro inch maximum thickness is not applicable). The manufacturer shall use the same solder dip process
for retinning as is used in the original manufacture of the product.
b.
When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescribed in
A.5.2a, approval for the process to be used for solder dip shall be based on the following test procedure:
(1) Thirty samples of any resistance value for each style and lead finish are subject to the manufacturer's
solder dip process. Following the solder dip process, the resistors are subjected to the dc resistance
test (and other group A electricals). No defects are allowed.
(2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.
(3) The remaining 20 samples are subjected to the resistance to bonding exposure test followed by the
moisture resistance test. No defects are allowed.
A.5.3 Solder dip/retinning options. The manufacturer (or authorized category B or category C distributor) may
solder dip/retin as follows:
a.
After the 100 percent group A screening tests and before group A solderability test: Following the solder
dip/retinning process, the electrical measurements required in group A, subgroup 1, 100 percent screening
tests shall be repeated on 100 percent of the lot. (NOTE: The manufacturer may solder dip/retin prior to the
100 percent electrical measurements of the group A, subgroup 1 tests). The percentage defective allowable
(PDA) for the electrical measurements shall be as for the subgroup 1 tests.
b.
As a corrective action, if the lot fails the group A solderability test: The lot may be retinned no more than two
times. The lot after retinning shall be 100 percent screened for group A electrical requirements (dc
resistance).Any parts failing (lot not exceeding PDA for group A, subgroup 1, see 4.6.3.2.1) these screens
shall not be supplied to this specification. If electrical failures exceeding 1 percent of the lot are detected
after the second retinning operation, the lot shall not be supplied to this specification.
c.
After the group A inspection has been completed: Following the solder dip/retinning process, the electrical
measurements required in group A, subgroup 1, 100 percent screening test shall be repeated on 100
percent of the lot. The PDA for the electrical measurements shall be as for the subgroup 1 tests. Following
these tests, the manufacturer shall submit the lot to the group A solderability test as specified in 4.6.3.2.4.
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