MIL-PRF-39017G
4.2 Reliability and quality.
4.2.1 QPL system. The manufacturer shall establish and maintain a QPL system in accordance with
3.3. Evidence of such compliance is a prerequisite for qualification and retention of qualification.
4.2.2 SPC. A SPC program shall be establish and maintained in accordance with EIA-557. Evidence
of such compliance shall be a prerequisite for qualification and verification of qualification.
4.3 Inspection conditions and precautions.
4.3.1 Inspection conditions. Unless otherwise specified herein, all inspections shall be performed in
4.3.2 Precautions. Adequate precautions shall be taken during inspection to prevent condensation of
moisture on resistors, except during moisture resistance test. Precautions shall be taken to prevent
damage by heat when soldering resistor leads to terminals.
4.4 Qualification inspection. Qualification inspection shall be performed at a laboratory acceptable to
the Government (see 6.3).
4.4.1 Sample. The number of sample units comprising a sample of resistors to be submitted for
qualification inspection shall be as specified in the appendix to this specification. The sample shall be
taken at random from a production run and shall be produced with equipment and procedures normally
used in production. With the exception of style RLR32, which shall be qualified separately (see 3.1).
4.4.2 Test routine. Sample units shall be subjected to the qualification inspection specified in table IX, in
the order shown. All 294 sample units shall be subjected to the inspection of group I. The 294 sample
units shall then be divided as specified in table IX for group III through VII inclusive, and subjected to the
inspection for their particular group. Twelve additional samples shall be subjected to group II. An
additional ten units shall be subjected to group VIII.
As an option, the manufacturer may develop a control procedure for minimum stabilization times
required for RTC testing. This procedure shall detail specific time elements required to reach thermal and
electrical stability for specific part designs. Documentation of this procedure and supporting results shall
be submitted to the qualifying activity for approval. Upon approval by the qualifying activity, the
manufacturer may use this procedure for minimum stabilization times for RTC testing.
4.4.3 Defectives. Defectives in excess of those allowed in table IX shall be cause for refusal to grant
qualification approval.
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