MIL-PRF-914/3B
5. PACKAGING.
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within
the military services system commands. Packaging data retrieval is available from the managing Military Department's
or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging
activity.
6. NOTES
(This section contains information of a general nature that may be helpful, but is not mandatory.
6.1 Intended use. Resistor networks are used in surface mount applications where space is a major concern.
6.2 Acquisition requirements. Acquisition documents must specify the following:
a.
Title, number, and date of the specification, and the complete PIN.
If not otherwise specified (see 2.1), the versions of the individual documents referenced will be those in
b.
effect on the date of release of the solicitation.
Packaging instructions (see 5.1) (e.g., Electrostatic discharge (ESD) sensitivity (see 6.5))
c.
d.
Allowable substitution.
6.3 Soldering. Extreme care should be taken when soldering these resistors. Prolonged exposure to high
temperatures can damage these devices.
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to
ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
6.5 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged,
by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or
shipping resistors. Direct shipment to the Government is controlled by MIL-DTL-39032 that specifies a preventive
packaging procedure.
6.5 Subject term (key word) listing.
Monolithic design
Wire bond and die construction
6.6 Changes from previous issue. The margins of this specification are marked with vertical lines to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes no
liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
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