MIL-PRF-55342/9E
4. VERIFICATION
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4.1 Verification. Verification shall be in accordance with MIL-PRF-55342.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor personnel, these
personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense
Agency, or within the military services system commands. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Chip resistors are intended to be used in thin or thick film hybrid circuits where micro-circuitry is
indicated and in surface mount applications.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, date of this specification, the applicable associated specification, and the complete PIN (see
1.2).
b. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents
referenced (see 2.2.1).
c. Packaging requirements (e.g., Electrostatic discharge (ESD) sensitivity) (see 5.1).
d. Allowable substitution (see MIL-PRF-55342).
e. If marking is required (see MIL-PRF-55342).
6.3 Tolerance for wraparound termination. The added tolerance for the wraparound type termination is intended to
apply only to termination, metallization, and pretinning material.
6.4 Electrostatic charge effects. Under relatively low humidity conditions, some types of film resistors, particularly
those with small dimensions and high sheet resistivity materials, are prone to sudden significant changes in
resistance (usually reductions in value) and to changes in temperature coefficient of resistance as a result of
discharge of static charges built up on associated objects during handling, packaging, or shipping. Substitution of
more suitable implements and materials can help minimize this problem. For example, use of cotton gloves, static
eliminator devices, air humidifiers, and operator and workbench grounding systems can reduce static buildup during
handling. Means of alleviating static problems during shipment include elimination of loose packaging of resistors and
use of metal foil (conductive) and static dissipation packaging materials. Direct shipments to the government is
controlled by MIL-DTL-39032 which specifies a preventive packaging procedure.
6.5 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes no
liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
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