MIL-PRF-26H
4.6.1.2 Group A inspection. Group A inspection shall consist of the examination and test specified in table III, and
shall be made on the same set of sample units, in the order shown.
4.6.1.2.1 Sampling plan.
4.6.1.2.1.1 Subgroup 1. A sample of parts from each inspection lot shall be randomly selected in accordance with
table IV, if one or more defects are found; the lot shall be rescreened and defects removed. After screening and
removal of defects, a new sample of parts shall be randomly selected in accordance with table IV, if one or more
defects are found in the second sample, the lot shall be rejected and shall not be supplied to this specification.
Resistance values in the samples shall be representative, and where possible, in proportion to the resistors in the
inspection lot.
4.6.1.2.1.2 Subgroup 2. A sample of parts from each inspection lot shall be randomly selected in accordance with
table III, if one or more defects are found, the lot shall be rescreened and defects removed. After screening and
removal of defects, a new sample of parts shall be randomly selected in accordance with table IV, if one or more
defects are found in the second sample, the lot shall be rejected and shall not be supplied to this specification.
4.6.1.2.1.3 Subgroup 3 (solderability).
4.6.1.2.1.3.1 Sampling plan. Five samples shall be selected randomly from each inspection lot and subjected to
the subgroup 3 solderability test. If there are one or more defects, the lot shall be considered to have failed.
4.6.1.2.1.3.2 Rejected lots. In the event of one or more defects, the inspection lot is rejected. The manufacturer
may use one of the following options to rework the lot:
a.
Each production lot that was used to form the failed inspection lot shall be individually submitted to the
solderability test as required in 4.7.5. Production lots that pass the solderability test are available for
shipment. Production lots failing the solderability test can be reworked only if submitted to the solder dip
procedure in 4.6.1.2.1.3.2b.
b.
The manufacturer submits the failed lot to a 100 percent solder dip using an approved solder dip process in
accordance with 3.4.2.1. Following the solder dip the electrical measurements required in group A,
subgroup 1 tests shall be repeated on 100-percent of the lot. Lot acceptance for the electrical
measurements shall be as for the subgroup 1 tests. Five additional samples shall then be selected and
subjected to the solderability test with zero defects allowed. If the lot fails this solderability test the lot may
be reworked a second time and be retested. If the lot fails the second rework, the lot shall be considered
rejected and shall not be furnished against the requirements of this specification.
4.6.1.2.1.3.3 Disposition of samples. The solderability test is considered a destructive test and samples submitted
to the solderability test shall not be supplied on the contract.
4.6.1.3 Group B inspection. Group B inspection shall consist of the tests specified in table V, in the order shown.
They shall be performed on sample units that have been subjected to and have passed the group A inspection,
unless the Government considers it more practical to select a separate sample from the lot for group B inspection.
4.6.1.3.1 Sampling plan. A sample of 13 parts shall then be randomly selected. If one or more defects are found,
the lot shall be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one
or more defects are found in the second sample, the lot shall be rejected and shall not be supplied to this
specification.
4.6.1.3.2 Disposition of sample units. Sample units that have passed all the group B inspection may be delivered
on the contract or order, at the option of the supplier.
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