MIL-PRF-23648F
3.3.2 Soldering flux. When soldering fluxes are required during the manufacturing process,
noncorrosive fluxes shall be used unless it can shown that the corrosive elements have been
satisfactorily removed or neutralized after soldering.
3.3.3 Tin plated finishes. Use of tin plating is prohibited as a final finish and as an undercoat (see 6.9).
Use of tin-lead (Sn-Pb) finishes are acceptable provided that the minimum lead content is 3 percent.
3.4 Zero power resistance. Each thermistor shall have a zero power resistance value within the
3.5 Resistance ratio characteristic. The resistance ratio shall be as specified (see 3.1 and 4.8.3).
3.6 Solderability (if applicable). When thermistors are tested as specified in 4.8.4, the dipped surface
of the leads shall be at least 95 percent covered with a new solder coating. The remaining 5 percent of
the lead surface shall show only small pinholes or voids; these shall not be concentrated in one area.
Bare base metal and areas where the solder dip failed to cover the original coating are indications of poor
solderability, and shall be cause for failure. In case of dispute, the percent of coverage with pinholes or
voids shall be determined by actual measurement of these areas, as compared to the total area (see 3.1).
3.7 Short time overload. When thermistors are tested as specified in 4.8.5, thermistors shall not arc,
burn, char, or open circuit. The change in zero power resistance shall not exceed the value specified
(see 3.1).
3.8 Insulation resistance. When thermistors are tested as specified in 4.8.6, the insulation resistance
shall not be less than 500 megohms.
3.9 Dielectric withstanding voltage. When thermistors are tested as specified in 4.8.7, there shall be
no evidence of mechanical or electrical damage, arcing, or breakdown.
3.10 Low temperature storage. When thermistors are tested as specified in 4.8.8, there shall be no
evidence of mechanical damage and the change in zero power resistance shall not exceed the value
specified (see 3.1).
3.11 High temperature storage. When thermistors are tested as specified in 4.8.9, the change in zero
power resistance shall not exceed the value specified (see 3.1).
3.12 Dissipation constant. When thermistors are tested as specified in 4.8.10, the dissipation constant
shall be as specified (see 3.1).
3.13 Thermal time constant. When thermistors are tested as specified in 4.8.11, thermal time constant
shall be as specified (see 3.1).
3.14 Terminal strength. When thermistors are tested as specified in 4.8.12, thermistors shall withstand
the specified pull or twist without evidence of mechanical damage. The change in zero power resistance
shall not exceed the value specified (see 3.1).
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