MIL-PRF-22/7D
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to
ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
6.5 Changes from previous issue. The margins of this specification are marked with vertical lines to indicate
where changes from the previous issue were made. This was done as a convenience only and the Government
assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to
evaluate the requirements of this document based on the entire content irrespective of the marginal notations and
relationship to the last previous issue.
Custodians:
Preparing activity:
Army - CR
DLA - CC
Navy - EC
Air Force - 11
DLA - CC
Review activities
(Project 5905-2007-008)
Army - AR, AT, AV, CR4
Navy - AS, CG, MC, OS
Air Force - 19
NOTE: the activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at https://assist.daps.dla.mil.
6
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