MIL-PRF-94G
APPENDIX A
TABLE A-III. Critical resistance value.
Resistance
Style
(in megohms)
RV5
0.10
RV6
0.25
RV2
0.10
RV4
0.10
A.3.3 Certification of material. When submitting samples for qualification, the supplier shall submit certification, in
duplicate, that the materials used in the components are in accordance with the applicable specification
requirements.
A.3.4 Description of items. The supplier shall submit a detailed description of the resistors being submitted for
inspection, including case material, element type, contact type, and method of fastening of terminals to base and
element.
A.4. EXTENT OF QUALIFICATION.
A.4.1 Single type submission. Qualification shall be for the type submitted.
A.4.2 Combined type submission. Qualification within a style and characteristic shall be shown in table A-IV.
Qualification of resistors with standard (N) type bushings shall qualify resistors with sealed (S) type bushings.
Conversely, qualification of resistors with sealed (S) type bushing shall qualify resistors with standard (N) type
bushing. Qualification of resistors with locking (L) type bushing shall qualify resistors with sealed (T) type bushings.
Conversely, qualification of resistors with sealed (T) type bushing shall qualify resistors with Locking (L) type bushing.
A.5. SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer (or his authorized category B or C distributor) may solder
dip/retin the leads of product supplied to this specification provided the solder dip process (A.5.2 of this appendix) or
an equivalent processes that has been approved by the qualifying activity.
A.5.2 Qualifying Activity Approval. Approval of the solder dip process will be based on one of the following
options:
When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276 (Note: The 200
a.
microinch maximum thickness is not applicable). The manufacturer shall use the same solder dip process
for retinning as is used in the original manufacture of the product.
b.
When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescribed in
A.5.2a, approval for the process to be used for solder dip shall be based on the following test procedure:
(1) Thirty samples of any resistance value for each style and lead finish are subjected to the manufacturer's
solder dip process. Following the solder dip process, the resistors are subjected to the dc resistance
test (and other group A electricals). No defects are allowed.
(2) Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.
(3) The remaining 20 samples are subjected to the resistance to solder heat test followed by the moisture
resistance test (or hermetic seal test if the device is hermetically sealed). No defects are allowed.
(Note: Solder dip of gold plated leads is not allowed).
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