MIL-PRF-83530C
APPENDIX A
PROCEDURE FOR QUALIFICATION INSPECTION
A.1 SCOPE
A.1.1 Scope. This appendix details the procedure for submission of samples, with related data, for qualification
inspection of resistors covered by this specification. This appendix is a mandatory part of this specification. The
information contained herein is intended for compliance.
A.2 APPLICABLE DOCUMENTS
A.2.1 Government documents.
A.2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation (see 6.2).
DEPARTMENT OF DEFENSE STANDARDS
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Leads for Electronic Component Parts
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or
https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094).
A.2.2 Order of precedence. In event of a conflict between the text of this document and the references cited herein
(except for related associated specifications, specification sheets, or MS sheets), the text of this document takes
precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
A.3. SUBMISSION
A.3.1 Sample. A sample consisting of 52 sample units of each part number for which qualification is sought shall
be submitted and subjected to the inspections of table II.
A.3.2 Test results. Each submission shall be accompanied by test results covering the nondestructive tests listed
in table II which have been performed on the submitted sample units. The performance of the destructive tests by the
supplier on a duplicate set of sample units is encouraged, although not required. All test results shall be submitted in
duplicate.
A.3.3 Description of items. The manufacturer shall submit a detailed description of the resistors being submitted
for inspection, including materials used for the resistor element and the protective enclosure or coating.
A.4. SOLDER DIP (RETINNING) LEADS
A.4.1 Solder dip (retinning) leads. The manufacturer may solder dip/retin the leads of product supplied to this
specification provided the solder dip process (see A.4.2 of appendix A) or an equivalent process has been approved
by the qualifying activity.
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