MIL-PRF-27208F
3.22 Low operating temperature. When resistors are tested as specified in 4.7.17, resistors shall meet the
following requirements:
Setting stability
Change shall not exceed 1 percent plus the specified
maximum resolution (see 3.1).
Operating torque
Shall not exceed 150 percent of the specified operating
torque (see 3.1).
Change shall not exceed ±(1 percent +0.05 ohms).
Total resistance
Visual examination
There shall be no evidence of mechanical damage.
3.23 High temperature exposure. When resistors are tested as specified in 4.7.18, resistors shall meet the
following requirements:
Setting stability:
Change shall not exceed 1 percent plus the specified
maximum resolution (see 3.1).
Change shall not exceed ±(1 percent +0.05 ohms).
Total resistance:
Operating torque:
Shall not exceed 150 percent of the specified operating
torque (see 3.1).
Dielectric withstanding voltage at
As specified in 3.11.
atmospheric pressure:
Insulation resistance:
Shall be not less than 1,000 megohms.
Visual examination
There shall be no evidence of mechanical damage.
3.24 Rotational life. When resistors are tested as specified in 4.7.19, the change in total resistance shall not
exceed ±2 percent, and there shall be no mechanical damage.
3.25 Terminal strength. When resistors are tested as specified in 4.7.20, there shall be no evidence of mechanical
damage, and resistors shall be electrically continuous.
3.26 Solderability (applicable to terminal types P, W, X, and Y). When resistors are tested as specified in 4.7.21,
the dipped surface of the terminals shall be at least 95 percent covered with a new, smooth, continuous surface free
from pin holes. The remaining 5 percent to the terminal surface may show pin holes, voids, or rough spots. These
shall not be concentrated in one area. Bare base metal and areas where solder dip has failed to cover the original
coating are indications of poor solderability, and shall be cause for failure. In case of dispute, the percentage of
coverage with pin holes or rough spots shall be determined by actual measurement of these areas, as compared to
the total area.
3.27 Immersion (applicable to terminal types P, W, X, and Y). When resistors are tested as specified in 4.7.22, no
continuous stream of bubbles shall emanate from any concentrated point of the resistor. When resistors are
subjected to the dye penetrate test, there shall be no evidence of dye in the internal cavities.
3.28 Fungus. All external materials shall be nonnutrient to fungus or shall be treated to retard fungus growth. The
manufacturer shall verify by certification that all external materials are fungus resistant or shall test resistors as
specified in 4.7.23. There shall be no evidence of fungus growth on the external surfaces.
3.29 Riveting. When riveting is required, the operation shall be carefully performed to insure that the rivets are
tight and satisfactorily headed. Riveting shall not be used in assembling two or more current carrying parts to an
insulating material.
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