MIL-R-10509/7J
TABLE II. Characteristic substitution.
MIL-R-10509 characteristic |
Substitute MIL-PRF-55182 characteristic |
C D E G |
H K J C |
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
6.5 Pulse applications. Designers are CAUTIONED on using these resistors in pulse applications. These resistors are subject to damage and premature failures when they see excessive pulsing
6.6 Changes from previous issue. The margins of this specification are marked with vertical lines to indicate where changes from the previous issue were made. This was done as a convenience only and the Government assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the requirements of this document based on the entire content irrespective of the marginal notations and relationship to the last previous issue.
Custodians: Preparing activity: Army - CR DLA - CC
Navy - EC
Air Force - 85
DLA - CC (Project 5905-2010-041)
Review activities:
Army - AR, AT, CR4, MI Navy - AS, CG, MC, OS
Air Force - 19
NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at https://assist.daps.dla.mil.
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