MIL-PRF-49465C
APPENDIX A
TABLE A-I. Tolerances
Tolerance
Characteristic
Will qualify
qualified
F
F, H, and J
T
H
H and J
J
J
TABLE A-II. Extension of qualification between sizes.
Associated
Will qualify
specification
-49465/1
/1
-49465/6
/6
-49465/7
/6, /7
A.5. SOLDER DIP (RETINNING) LEADS
A.5.1 Solder dip (retinning) leads. The manufacturer may solder dip/retin the leads of product supplied to this
specification provided the solder dip process (see A.5.2 of this appendix) or an equivalent process has been
approved by the qualifying activity.
A.5.2 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options:
a.
When the original lead finish qualified was hot solder dip lead finish 52 of MIL-STD-1276 (Note: The 200
microinch maximum thickness is not applicable). The manufacturer shall use the same solder dip process
for retinning as is used in the original manufacture of the product.
b.
When the lead originally qualified was not hot solder dip lead finish 52 of MIL-STD-1276 as prescribed in
A.5.2a, approval for the process to be used for solder dip shall be based on the following test procedure:
(1)
Thirty samples of any resistance value for each style and lead finish are subjected to the
manufacturer's solder dip process. Following the solder dip process, the resistors are subjected to the
dc resistance test and other group A electricals. No defects are allowed.
(2)
Ten of the 30 samples are then subjected to the solderability test. No defects are allowed.
(3)
The remaining 20 samples are subjected to the resistance to solder heat test followed by the moisture
resistance test. No defects are allowed.
A.5.3 Solder dip/retinning options. The manufacturer may solder dip/retin as follows:
a.
After the group A tests: Following the solder dip/retinning process, the electrical measurements required in
group A, subgroup 1, shall be repeated on the lot. The group A, subgroup 1, lot rejection criteria shall be
used. Following this test, the manufacturer shall submit the lot to the group A solderability test as specified
in 4.8.3.
b.
As a corrective action, if the lot fails the group A solderability test, the lot may be retinned no more than two
times. The lot after retinning shall be 100 percent screened for group A electrical requirements
(dc resistance) and parts failing (lot not exceeding PDA for group A, subgroup 1, see 4.6.2.1) these screens
shall not be supplied to this specification, if electrical failures are detected after the second retinning
operation exceeding 1 percent of the lot, the lot shall not be supplied to this specification.
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