MIL-PRF-39023/3C
3.4 Maximum total resistance. The maximum total resistance value shall be 1.0 megohm.
3.5 Mechanical travel. The mechanical travel shall be 360 degrees continuous.
3.6 Theoretical electrical travel. The theoretical electrical travel shall be 340 degrees.
3.7 Ganged cups. There shall be no more than 3 cups ganged.
3.8 Phasing. The phasing shall be for simultaneous conformity.
3.9 Weight. The maximum weight shall be 3.0 ounces and each additional cup shall be 1.5 ounces.
3.10 Function conformity. The type of conformity shall be independent linearity.
3.11 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin
content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum
of 3 percent lead, by mass (see 6.4).
4. VERIFICATION
4.1 Sampling for delivery shall be in accordance with MIL-PRF-39023.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within
the military services system commands. Packaging data retrieval is available from the managing Military Department's
or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging
activity.
6. NOTES
(This section contains information of general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The intended use specified in MIL-PRF-39023 will be applicable to this specification.
6.2 Acquisition requirements. Acquisition documents must specify the following:
Title, number, and date of this specification, and the complete PIN (see 1.2).
a.
b.
If not otherwise specified (see 2.1), the versions of the individual documents referenced will be
those in effect on the date of release of the solicitation.
c.
Packaging requirements (see 5.1).
6.3 PIN. This specification requires a PIN that describes technology and appropriate references to associated
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to
ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
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